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Direct Bonded Copper (DBC) Products AlSiC Composite Materials for Thermal Management Leadframes - Specialised Stamping and Plating Thick-Film Materials and Ceramic Tapes Wafer Level Packaging Equipments Graphene & Graphene Oxide

Wafer Level Manufacturing Services Engineering and Prototyping of Integrated Circuits Technical Consultancy and Engineering

Leadframes - Custom Stamping and Plating AlSiC Composite Materials for Thermal Management Direct Bonded Copper (DBC) Products Thick-Film Materials and Ceramic Tapes Engineering and Prototyping of Integrated Circuits Wafer Level Bumping & Packaging

Batten & Allen Boschman Advanced packaging technology CPS Technologies curamik® Rogers Germany Endurans Solar Ferro - ESL products Graphenea Microdul Pac Tech Sinergo